MID Technology

The term MID stands for Mechatronic Integrated Devices (multi-functional 3-D circuit carriers). The processes mentioned here are employed in the manufacture of circuit carriers which, because they are multi-functional, can be used in many places. They differ mainly in terms of tool costs, flexibility, 3-D capability and degree of miniaturisation. MID allows the reduction of component diversity and a shortening of the process chain. Thanks to decades of experience 2E mechatronic GmbH & Co.KG is one of the market leaders in the field of MID technology.

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  • OLED

    1,00 €

    In connection with the MID technology, the organic light diodes maintain their flat structure and can simultaneously be equipped with a housing and the required electronics and connection technology.

  • UNC-LED-diodes

    1,00 €

    Their constant power source for uniform luminosity and standardised UNC thread enables them to be used, for example, for laryngoscopes.

  • LDS Product sample
    LED diodes

    1,00 €

    In the LDS process, the conductor-path layout is written by laser onto the moulded 3D plastic part. The conductor paths are constructed with an electroless metallization process.

  • LDS Product sample
    MID Flow Sensor

    1,00 €

    In the LDS process, the conductor-path layout is written by laser onto the moulded 3D plastic part. The conductor paths are constructed with an electroless metallization process.

Laser direct structuring (LDS)
In the production of an LDS MID a laser beam is used to activate an additive hidden in the plastic. This enables conductor paths <150μm in size to be produced and is therefore excellent for miniaturisation. An LDS MID has the advantage of allowing changes to the conductor path layout to be carried out quickly and cost-effectively. The process is suitable for three-dimensional components, even in small quantities.

Hot-embossing process
In this process the conductor paths (coated copper film) are stamped into the workpiece by means of heat and pressure using a hot stamping die. The surplus foil is subsequently removed using an adhesion technique. SMD components can then be mounted or assembly technology used. The hot-embossing process is only possible for two-dimensional workpieces and suitable for medium-sized production volumes.

2-component injection moulding
In the two-component injection moulding process two different plastics are used, one metallizable and the other not. The base body is formed from the first metallizable material and is then injection-moulded with the second material. Conductor paths are then produced using an electroless metallization process. The 2E injection moulding process is suitable for three-dimensional MIDs in large quantities.