The term MID stands for Mechatronic Integrated Devices (multi-functional 3-D circuit carriers). The processes mentioned here are employed in the manufacture of circuit carriers which, because they are multi-functional, can be used in many places. They differ mainly in terms of tool costs, flexibility, 3-D capability and degree of miniaturisation. MID allows the reduction of component diversity and a shortening of the process chain. Thanks to decades of experience 2E mechatronic GmbH & Co.KG is one of the market leaders in the field of MID technology.
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In connection with the MID technology, the organic light diodes maintain their flat structure and can simultaneously be equipped with a housing and the required electronics and connection technology.
Their constant power source for uniform luminosity and standardised UNC thread enables them to be used, for example, for laryngoscopes.
In the LDS process, the conductor-path layout is written by laser onto the moulded 3D plastic part. The conductor paths are constructed with an electroless metallization process.
In the LDS process, the conductor-path layout is written by laser onto the moulded 3D plastic part. The conductor paths are constructed with an electroless metallization process.