LaserDirektStrukturieren

Beim LDS-Verfahren wird das Leiterbahn-Layout per Laser auf das 3D-Kunststoff Formteil geschrieben. Der Aufbau der Leiterbahnen erfolgt mit Hilfe einer außenstromlosen Metallisierung.

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  • LDS Product sample
    LED diodes

    In the LDS process, the conductor-path layout is written by laser onto the moulded 3D plastic part. The conductor paths are constructed with an electroless metallization process.

  • LDS Product sample
    MID Flow Sensor

    In the LDS process, the conductor-path layout is written by laser onto the moulded 3D plastic part. The conductor paths are constructed with an electroless metallization process.