In the LDS process, the conductor-path layout is written by laser onto the moulded 3D plastic part. The conductor paths are constructed with an electroless metallization process.
In connection with the MID technology, the organic light diodes maintain their flat structure and can simultaneously be equipped with a housing and the required electronics and connection technology.
In the LDS process, the conductor-path layout is written by laser onto the moulded 3D plastic part. The conductor paths are constructed with an electroless metallization process.
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